The POU3500 method delivers dynamic temperature Charge of the procedure chamber cathode / electrode / anode and may be synchronized with any etch procedure.

thirty% of its peak electric power consumption, giving our clients important reduction in operating charges and improved dependability.

the data down below is categorized by semiconductor course of action and tool company. Each individual table involves an purposes Matrix that exhibits qulified and business processes.

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LAUDA-Noah will, for just a shopper's retrofit analysis, watch and adjust its fluid temperature Command profiles to match an current TCUs' if you want to guarantee a sleek process integration by using DAQ.

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All static more info TCUs have to have surplus cooling & heating capacities due to their really large system fluid reservoirs. The process fuid reservoir on LAUDA-Noah's dynamic temperature control process is fewer than 1 gallon.

Together with the POU3300, it is possible to attain unprecedented results in etch general performance, chamber uptime, decreased cost of ownership and fab Place utilization – all when enhancing your system reliability.

big Footprint: Static units occupy substantial Place within the fabrication Software region, reducing its effectiveness.

Dynamic Temperature Manage, as applied in devices such as the LAUDA-Noah POU, is an tactic that senses the temperature of the method fluid getting back from the process chamber’s wafer chuck (ESC) and dynamically adjusts the temperature from the supplied process fluid according to this actual-time feedback.

the information established here is from the 200mm quantity production wafer fab and clearly illustrates the good thing about the LAUDA-Noah POU technique.

More than at any time, shrinking device geometries, demanding new processes and a remarkably aggressive surroundings demand temperature Management methods that Mix quickly and accurate temperature Command with the emphasis on lowered functioning fees and enhanced trustworthiness.

The reality is the fact that true Dynamic Temperature Control can only be realized when all 5 (five) of the subsequent process layout and set up demands are fulfilled:

(Therefore, setting up a static device next to chamber will not likely enable it to offer dynamic temperature Manage)

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